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Esec 8003 Wafer Dicing Saw UVOCS 10x10-OES
The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". It has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability... The UV-Ozone cleaning process provides a simple, inexpensive, and fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic substances...