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Esec 8003 Wafer Dicing Saw Exatron Model 902 Pick and Place Handler
The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". It has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability...

The Exatron Model 900 pick and place handler automates testing, programming, transfer, laser marking, and inspection of devices in any engineering or small-to-medium volume production environment. Adaptable to all of Exatron’s standard building blocks and easily customized to meet any need, the Model 900 is a versatile, dependable workhorse.

SYSTEM CONFIGURATION
Exatron model 902 random sort handler with tape output and test options
Computer Operating System: Windows 2000
Exatron Software: Applied Motion Works ver. 1.1.6

POSITIONING SYSTEM:
X-Y Drive System: Servo motor-driven lead screws

X-Y Axis Resolution: 0.1mm (0.003”)

X-Y Axis Max. Velocity: 122cm/s (48”/s)

Z Plunger: Servo motor-driven lead screws

Z Axis Resolution: +/- 0.1mm (0.003”)

Z Axis Repeatability: +/- 0.1mm (0.003”)

Placement Force: Up to 10kg (20 lbs) force with standard pickup heads

Theta Drive System: Precision stepper motors

Theta Axis Resolution: 0.1°

Theta Axis Repeatability: +/- 0.1mm (0.003")

FACILITY SERVICES:
Power Required: 100-240 VAC, 50/60Hz (current depends on options)

Air Pressure Required: 80 psi clean dry, air at 2 CFM (typical, add 1.5 CFM per each venutri added)
UVOCS 10x10-OES UVOCS 10x10-OES
The UV-Ozone cleaning process provides a simple, inexpensive, and fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic substances... The UV-Ozone cleaning process provides a simple, inexpensive, and fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic substances...