Description
The Samco Model UV-300H UV-Ozone Stripper Cleaner can be used for stripping or cleaning organic materials from a wide variety of substrate materials. The system process substrates using a combination of UV light, ozone and heat to clean substrates at atmospheric pressure.
FEATURES:
Substrate Loading: Easy, drawer-type slide to load substrates
Operating Pressure: Atmospheric pressure
Cleaing Process: Dry process using UV light, Ozone and Heat to completely clean delicate electrical circuits
APPLICATIONS: Stripping photoresist and polyimide; ink removal from EPROM wafers (without erasing programs); removing organic contamination from substrates prior to thin film deposition; preparing surface for photoresist; descumming photoresist and E-Beam resist; cleaning wafers prior to wafer bonding
Dimensions: 27W x 31D x 50H (inches)
FACILITY REQUIREMENTS:
Power: 115VAC; 1PH; 40A
Cooling Water: 50-75 degrees F; 48-42 psig pressure differential between supply & drain
Process Gasses: Oxygen (O2) - 14.2 psig; 0-20 SLM flow (max)
Purge: Nitrogen (N2) - 25 psig; 37-50 SLM flow
Compressed Air (to raise & lower substrate heater): Dry air; 85 psig
Venting: Customer provided; should be Teflon, Stainless Steel or Aluminum in construction; negative pressure not to exceed 0.2 inches of water column
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