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Matrix System One Model 105 Plasma Asher/Stripper/Descum
Matrix System One Model 105 Plasma Asher/Stripper/Descum

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Product Code: 10273
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The Matrix 105 plasma asher uses oxygen, plasma and heat to remove photoresist on silicon, GaAs and other substrates.  It can also be used to remove photoresist residue after development (descum).  The Matrix 105 can process up to 6” wafers, or pieces of wafers using special fixtures.

    • Single wafer, single cassette, robotic asher and etcher
    • Menu-driven microprocessor / controller
    • Multi-step programming (three steps + over etch) 
    • Wafer pin lift assembly (up/down)
    • Mass flow controllers: qty 2
    • Wafer size range: 3-6 inch / 75-150 mm
    • RF power supply: 600W, 13.56MHz, water-cooled 
    • Ash/Strip temperature range: 70-250 deg C
    • Descum temperature range: 70-150 deg C

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