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Matrix System One Model 105 Plasma Asher/Stripper/Descum
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Product Code:
10273
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Description
The Matrix 105 plasma asher uses oxygen, plasma and heat to remove photoresist on silicon, GaAs and other substrates. It can also be used to remove photoresist residue after development (descum). The Matrix 105 can process up to 6” wafers, or pieces of wafers using special fixtures.
Features
Single wafer, single cassette, robotic asher and etcher
Menu-driven microprocessor / controller
Multi-step programming (three steps + over etch)
Wafer pin lift assembly (up/down)
Mass flow controllers: qty 2
Wafer size range: 3-6 inch / 75-150 mm
RF power supply: 600W, 13.56MHz, water-cooled
Ash/Strip temperature range: 70-250 deg C
Descum temperature range: 70-150 deg C
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