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Home > Semiconductor Equipment > Esec 8003 Wafer Dicing Saw Alternative Views: Request A Quote Product Code: 10033 Thanks for looking! Description   The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". The Esec 8003 has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability. Equipment Specifications: Wafer diameter: 25.4mm-152.4mm (1in.-6in.) Wafer thickness: 0.01mm-5.0mm (0.3mil-196.9mil) X-axis (feed): 240mm (9.45in.) Y-axis (index): 165mm (6.5in.) Index step: 0.02mm-99.999mm (0.79mil-3937mil) Z-axis (vertical): 10mm (.393in.) Rotation angle: 0.01-165 degrees Spindle speed: 15,000-50,000 rpm Power requirements: 220VAC, 50/60Hz, 2.5kVa Air pressure: 64-85 psi Water pressure: to 85 psi Related Products... Karl Suss MJB3 Mask Aligner Request A Quote Hitachi S-7000 Critical Dimension Scanning Electron Microscope (CD SEM) Request A Quote Cascade Microtech® Summit 12000 Semi-Automatic Wafer Probe Station Request A Quote Surface Technology Systems (STS) Multiplex Reactive Ion Etcher (RIE) Request A Quote Glen R3A Plasma Cleaner Request A Quote Share your knowledge of this product with other customers... Be the first to write a review Browse for more products in the same category as this item: Semiconductor Equipment Semiconductor Equipment > Assembly, Packaging & Final Test Semiconductor Equipment > Assembly, Packaging & Final Test > Scribing & Dicing Equipment