Refurbished Semiconductor Manufacturing Equipment, Research & Development Equipment, Laboratory and Test Equipment
ACCOUNT LOGIN
www.1spectrum.com
Home
About Us
Featured Products
New Arrivals
Terms & Conditions
Contact Us
Sale Items
New Arrivals
Home
>
Semiconductor Equipment
>
Surface Technology Systems (STS) Multiplex Reactive Ion Etcher (RIE)
Alternative Views:
Request A Quote
Product Code:
10050
Thanks for looking!
Description
Technical Specs
The Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum load lock with STS etch plasma source to produce a platform of unrivaled quality and reliability for both R&D and pilot-production applications.
SYSTEM DESCRIPTION:
Surface Technology Systems Multiplex Reactive Ion Etcher (RIE) designed for etching of 3-8 inch GaAs wafers. System can be configured with Multiplex Atmospheric Cassette System (MACS wafer handling module shown in photo; upgrade option; subject to availability). System includes: load lock, PC-controlled RIE process chamber, power distribution cabinet, RF rack, remote gas box, and chiller.
SPECIAL NOTE:
Photos show the system configured with the OPTIONAL Multiplex Atmospheric Cassette System (MACS) attached. The MACS module allows for automated wafer loading (2 cassettes); it can be run in automatic mode (cassette-to-cassette) or manual mode (manual wafer load).
MACS MODULE SOLD SEPARATELY.
STS Multiplex RIE System Configuration:
MACS Wafer Loader: Multiplex Atmospheric Cassette System for automated wafer loading (2 cassettes); can run in automatic mode (cassette-to-cassette) or manual mode (manual wafer load); upgrade option; subject to availability at time of order
Load Lock System: Wafer size from 3 inch to 8 inch (75mm to 200mm) capable; Wafer set size = 6 inch (150mm); requires Leybold Ecodry L rotary pump or equivalent (not included).
RIE Process Module: MESC RIE SC100M process chamber; version 1.0; PC controlled; Intellimetrics end-point detector (EPD) sn300.110+sn300.002+sn300.001+frame grabber; Electrode temperature control (+5 to +40 deg C); non-clamped electrode; ENI ACG3B 300/30 watt (13.56MHz) RF supply & matching unit; Remote gasbox; requires Leybold Dryvac 50S dry pump or equivalent (not included)
Electrode Cooling: Bettatech CU500 chiller (DI water +5 to +40 deg C)
Gasbox: Remote R/H (standard - inc 2x PFC1 module); (1) O2=100sccm; (2) Ar=100sccm; (3) CF4=200sccm; (4) CHF3=200sccm.
Vintage: 2001
Related Products...
Glen R3A Plasma Cleaner
Request A Quote
Samco UV-300H UV-Ozone Stripper / Cleaner
Request A Quote
Cascade Microtech® Summit 12000 Semi-Automatic Wafer Prober
Request A Quote
Cascade Microtech® Summit 12000 Semi-Automatic Wafer Probe Station
Request A Quote
Matrix System One Model 105 Plasma Asher/Stripper/Descum
Request A Quote
Share your knowledge of this product with other customers...
Be the first to write a review
Browse for more products in the same category as this item:
Semiconductor Equipment
Semiconductor Equipment
>
Wafer Processing
Semiconductor Equipment
>
Wafer Processing
>
Etcher/Ashers/Strippers